Definition, Meaning & Anagrams | English word HEATSINK

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Definitions of HEATSINK

1. Alternative spelling of heat sink.
2. (transitive) To fit with a heat sink.

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Examples of Using HEATSINK in a Sentence

• High-power devices (such as high-voltage op-amp ICs, voltage regulators, and motor driver ICs) are still being manufactured in a package with a zig-zag pinout (and normally screwed onto a heatsink).
• Zalman's product range includes heat sink and fan solutions for CPUs, as well as quiet power supplies, computer water cooling systems, motherboard chipset coolers, graphics card heatsink and fan combos, laptop coolers, cases, and hard disk cases that lower temperature and reduce noise.
• Dust acting as a thermal insulator and impeding airflow, thereby reducing heatsink and fan performance.
• An array of slightly compressible conductive columns held in a frame is then sandwiched between the two LGA surfaces and compressed using the heatsink.
• Intel calculates a specified chip's TDP according to the amount of power the computer's fan and heatsink need to be able to dissipate while the chip is under sustained load.
• Components with significant power consumption (CPUs, GPUs, FPGAs) often require a larger heatsink which does not fit within the traditional board spacing.
• Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmitting information, as when the leads from an electrocardiograph are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink.
• Used to cool the heatsink of the northbridge of a motherboard's chipset; this may be needed where the system bus is significantly overclocked and dissipates more power than as usual, but may otherwise be unnecessary.
• 3 W, which results in the usage of integrated heat spreader (IHS) design over the chip to help heat spread evenly, with ASUS even adding water cooling block directly on top of the heatsink of the X38 Northbridge as a part of the motherboard heatpipe system.
• Formation of cracks and intermetallic growth in die attachments may lead to formation of voids and delamination, impairing heat transfer from the chip die to the substrate and heatsink and causing a thermal failure.
• The most common types of SMD are: 3528, single colour, non-addressable, very low power; 5050, containing three LEDs allowing for RGB and addressable strips as well as higher power levels; 2835, a newer single-color SMD having the same surface dimensions as the 3528 but a larger emitter area and a thinner design with an integrated heatsink allowing for higher power levels; 5630/5730, a newer replacement for single-color 5050 SMDs which can operate at slightly higher power levels and have high efficacy.
• The more common P0 variant has two sub-options for heatsink mounting – designated as square ILM and narrow ILM, choice of which depends on the server and mainboard design (likely based on space constraints).

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